Kunshan Wanwei Electronic Technology Co., Ltd.
Contact: Mr. Zhao
Address: No. 89 Luxing Road, Zhoushi Town, Kunshan City
Kunshan thermal pad has a certain thermal conductivity and flexibility of silicon filling material, mainly used in the gap between the semiconductor devices and heat transfer between the heat sink surface. The excellent flexibility can reduce the pressure on the device while the higher thermal conductivity can provide excellent thermal conductivity in a small space. Because the material is self-adhesive, no back-gluing is required to affect the thermal conductivity. Thermally conductive gaskets are used in a wide range of applications such as notebook computers, large storage devices, and audio and video components.
High thermal conductivity
● Self-adhesive or single-sided adhesive products
● Meet RoHS requirements
● The 211 series is characterized by its suitability for applications requiring high hardness. Series High hardness
● 212 series products are characterized by lower thermal resistance under different thermal conductivity
● The 218 series features up to 50% compression deformation under low pressure
● All thermal pads can be specially treated as required. Glass fiber reinforced product is F and single-sided adhesive product is A.